Wollschlager, J., Yuan, Z., Fish, J. (2016). Challenge Problems for the Benchmarking of Micromechanics Analysis: Multiscale Designer Level I Results. In: Proceedings of the 31st ASC Technical Conference. Williamsburg, VA.

Travaglini, S., Dharan, C., Ross, P. (2016). Manufacturing of Mycology Composites. In: Proceedings of the 31st ASC Technical Conference. Williamsburg, VA.

Jensen, B., Wise, K., Odegard, G. M. (2016). Molecular Dynamics Modeling of Carbon Nanotube Composite Fracture using ReaxFF. In: Proceedings of the 31st ASC Technical Conference. Williamsburg, VA.

Morales, B., Fittipaldi, M., Damley-strnad, A., Grace, L. (2016). A Biocompatible Pressure Sensor Based on Styrene-Isobutylene-Styrene (SIBS) and Carbon Black. In: Proceedings of the 31st ASC Technical Conference. Williamsburg, VA.

Cao, X., Tian, H., Dalir, H. (2016). Development of a New Finite Element Simulation Strategy for Prediction of Thermal and Resin Shrinkage Deformations of Composite Parts During Cure. In: Proceedings of the 31st ASC Technical Conference. Williamsburg, VA.

Sheidaei, A., Pourboghrat, F., Park, T., Abu-farha, F. (2016). Identification of Material Parameters for Damage Model of Ductile Failure in Thermoplastic Polymers. In: Proceedings of the 31st ASC Technical Conference. Williamsburg, VA.

Liddell, H., Brueske, S., Carpenter, A., Cresko, J. (2016). Manufacturing Energy Intensity and Opportunity Analysis for Fiber-Reinforced Polymer Composites and Other Lightweight Materials. In: Proceedings of the 31st ASC Technical Conference. Williamsburg, VA.

Kakanuru, P., Pochiraju, K. (2016). Micromechanical Modeling of Oxidation Induced Stresses in SiC/SiC Composites. In: Proceedings of the 31st ASC Technical Conference. Williamsburg, VA.

Tessema, A., Mymers, N., Patel, R., Ravindran, S., Kidane, A. (2016). Experimental Investigation on the Correlation between Damage and Thermal Conductivity of CFRP. In: Proceedings of the 31st ASC Technical Conference. Williamsburg, VA.

Vashisth, A., Bakis, C. (2016). Characterization of Nanosilica Filled Bis F Epoxide with Diamino Diphenyl Sulfone Curing Agents. In: Proceedings of the 31st ASC Technical Conference. Williamsburg, VA.